TY - GEN
T1 - 33.4 A Multi-Loop Neuromodulation Chipset Network with Frequency-Interleaving Front-End and Explainable AI for Memory Studies in Freely Behaving Monkeys
AU - Hou, Yuhan
AU - Zhu, Yi
AU - Wu, Xiao
AU - Li, Yinfei
AU - Lucas, Timothy
AU - Richardson, Andrew
AU - Liu, Xilin
N1 - Publisher Copyright:
© 2024 IEEE.
PY - 2024
Y1 - 2024
N2 - Alzheimer's disease (AD), a common cause of dementia, affects over 30 million people worldwide and accounts for more than 1% of the global GDP [1]. Given that age is a significant risk factor, the number of AD patients is projected to double in the next two decades. While there is currently no cure for AD, increasing evidence suggests that electrical brain stimulation is a potential treatment [2]. The hippocampus (HC) is a critical brain region that exhibits specific rhythmic neural activities during memory encoding and consolidation. In-phase stimulation has the potential to entrain and amplify these rhythms, thereby enhancing memory formation and retrieval. Consequently, innovative stimulation protocols are being developed to treat AD by modulating the HC and its associated brain regions.
AB - Alzheimer's disease (AD), a common cause of dementia, affects over 30 million people worldwide and accounts for more than 1% of the global GDP [1]. Given that age is a significant risk factor, the number of AD patients is projected to double in the next two decades. While there is currently no cure for AD, increasing evidence suggests that electrical brain stimulation is a potential treatment [2]. The hippocampus (HC) is a critical brain region that exhibits specific rhythmic neural activities during memory encoding and consolidation. In-phase stimulation has the potential to entrain and amplify these rhythms, thereby enhancing memory formation and retrieval. Consequently, innovative stimulation protocols are being developed to treat AD by modulating the HC and its associated brain regions.
UR - http://www.scopus.com/inward/record.url?scp=85188105944&partnerID=8YFLogxK
U2 - 10.1109/ISSCC49657.2024.10454413
DO - 10.1109/ISSCC49657.2024.10454413
M3 - Conference contribution
AN - SCOPUS:85188105944
T3 - Digest of Technical Papers - IEEE International Solid-State Circuits Conference
SP - 548
EP - 550
BT - 2024 IEEE International Solid-State Circuits Conference, ISSCC 2024
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2024 IEEE International Solid-State Circuits Conference, ISSCC 2024
Y2 - 18 February 2024 through 22 February 2024
ER -