TY - GEN
T1 - A Biocompatible Glass-Encapsulated Triaxial Force Sensor For Implantable Tactile Sensing Applications
AU - Ding, Yixiao
AU - Du, Lin
AU - Hao, Han
AU - Mier, Thomas C.E.
AU - Van Der Spiegel, Jan
AU - Lucas, Timothy H.
AU - Aflatouni, Firooz
AU - Richardson, Andrew G.
AU - Allen, Mark G.
N1 - Publisher Copyright:
© 2024 IEEE.
PY - 2024
Y1 - 2024
N2 - This paper reports a microfabricated triaxial capacitive force sensor. The sensor is fully encapsulated with inert and biocompatible glass (fused silica) material. The sensor comprises two glass plates, on which four capacitors are located. The sensor is intended for subdermal implantation in fingertips and palms and providing tactile sensing capabilities for patients with paralyzed hands. Additional electronic components, such as passives and IC chips, can also be integrated with the sensor in a hermetic glass package to achieve an implantable tactile sensing system. Through attachment to a human palm, the sensor has been shown to respond appropriately to typical hand actions, such as squeezing or picking up a bottle.
AB - This paper reports a microfabricated triaxial capacitive force sensor. The sensor is fully encapsulated with inert and biocompatible glass (fused silica) material. The sensor comprises two glass plates, on which four capacitors are located. The sensor is intended for subdermal implantation in fingertips and palms and providing tactile sensing capabilities for patients with paralyzed hands. Additional electronic components, such as passives and IC chips, can also be integrated with the sensor in a hermetic glass package to achieve an implantable tactile sensing system. Through attachment to a human palm, the sensor has been shown to respond appropriately to typical hand actions, such as squeezing or picking up a bottle.
KW - Triaxial force sensor
KW - biocompatible package
KW - capacitive sensing
KW - fused silica
KW - fusion bonding
KW - hermetical package
KW - tactile sensing
UR - http://www.scopus.com/inward/record.url?scp=85186734291&partnerID=8YFLogxK
U2 - 10.1109/MEMS58180.2024.10439390
DO - 10.1109/MEMS58180.2024.10439390
M3 - Conference contribution
AN - SCOPUS:85186734291
T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
SP - 821
EP - 824
BT - IEEE 37th International Conference on Micro Electro Mechanical Systems, MEMS 2024
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 37th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2024
Y2 - 21 January 2024 through 25 January 2024
ER -